Microcontrollers, Microprocessor, FPGA Modules

Compare the current Microcontrollers, Microprocessor, FPGA Modules Embedded selection by manufacturer, stock status, datasheet and technical parameters. Use these details to narrow the list to parts that match your design, maintenance or purchasing requirements.

For a specific MPN, package, electrical rating or quantity requirement, send the details to EGOO. We can help confirm availability, quotation and alternative sourcing options.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0813-01-4AE11-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,404	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0813-02-4AE81-A MPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH	3,142	-	RFQ	Datasheet	Zynq UltraScale+	Bulk	Active	MPU Core	Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0813-01-3BE11-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	3,799	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0813-02-3BE81-A MPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH	2,821	-	RFQ	Datasheet	Zynq UltraScale+	Bulk	Active	MPU Core	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0821-01-3BE21ML MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,709	-	RFQ	Datasheet	TE0823	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU3EG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3BE81MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,289	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0821-01-3BE21MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,195	-	RFQ	Datasheet	TE0823	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU3EG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
AM0010-02-4AE21MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	2,954	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq™ UltraScale+™ ZU4CG-1E	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3BI21ML MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	1,446	-	RFQ	Datasheet	TE0820	Bulk	Last Time Buy	MPU Core	-	-	-	8GB eMMC, 128MB QSPI	2GB	-	-	-
TE0821-01-3AE31PA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	2,492	-	RFQ	Datasheet	TE0823	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU3CG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	4GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules FAQ

How can I narrow the current Microcontrollers, Microprocessor, FPGA Modules selection?

Use the available manufacturer and technical filters to compare matching parts by specifications, stock status, pricing and datasheet information.

Can EGOO help source hard-to-find or obsolete Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send the manufacturer part number and required quantity to our sourcing team for availability, lead-time and alternative sourcing support.

Can I request a quotation for a BOM or small-batch requirement?

Yes. EGOO supports BOM sourcing, prototype quantities and small-batch purchasing. Provide your part list and quantities for a quotation review.

What information should I provide when requesting a quote?

Please provide the target part number, manufacturer, quantity and any required date code, package or delivery requirements so our team can respond more accurately.