Microcontrollers, Microprocessor, FPGA Modules

Compare the current Microcontrollers, Microprocessor, FPGA Modules Embedded selection by manufacturer, stock status, datasheet and technical parameters. Use these details to narrow the list to parts that match your design, maintenance or purchasing requirements.

For a specific MPN, package, electrical rating or quantity requirement, send the details to EGOO. We can help confirm availability, quotation and alternative sourcing options.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0820-05-5DI81MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	2,875	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0813-01-5DI21-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,294	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU5EV-1SFVC784I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0813-02-5DI81-A MPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH	3,845	-	RFQ	Datasheet	Zynq UltraScale+	Bulk	Active	MPU Core	Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
AM0010-02-5DI21MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,344	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq™ UltraScale+™ ZU5EV-1I	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.220" L x 1.575" W (56.40mm x 40.00mm)	-40°C ~ 85°C
TE0741-04-G2I-1-A MODULE FPGA KINTEX Trenz Electronic GmbH	1,897	-	RFQ	Datasheet	-	Box	Obsolete	FPGA Core	Xilinx Kintex-7 FPGA XC7K410T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0818-01-9GI21-A ULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH	1,929	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0818-01-BBE21-A ULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH	2,952	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0841-02-31I21-A IC MODULE Trenz Electronic GmbH	3,974	-	RFQ	Datasheet	TE0841	Bulk	Discontinued at Digi-Key	FPGA Core	Kintex UltraScale KU035	-	-	64MB	2GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-9GI81-A ULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH	2,017	-	RFQ	Datasheet	-	Bulk	Discontinued at Digi-Key	-	-	-	-	-	-	-	-	-
TE0745-02-92I31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	1,161	-	RFQ	Datasheet	TE0745	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules FAQ

How can I narrow the current Microcontrollers, Microprocessor, FPGA Modules selection?

Use the available manufacturer and technical filters to compare matching parts by specifications, stock status, pricing and datasheet information.

Can EGOO help source hard-to-find or obsolete Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send the manufacturer part number and required quantity to our sourcing team for availability, lead-time and alternative sourcing support.

Can I request a quotation for a BOM or small-batch requirement?

Yes. EGOO supports BOM sourcing, prototype quantities and small-batch purchasing. Provide your part list and quantities for a quotation review.

What information should I provide when requesting a quote?

Please provide the target part number, manufacturer, quantity and any required date code, package or delivery requirements so our team can respond more accurately.