Microcontrollers, Microprocessor, FPGA Modules

Compare the current Microcontrollers, Microprocessor, FPGA Modules Embedded selection by manufacturer, stock status, datasheet and technical parameters. Use these details to narrow the list to parts that match your design, maintenance or purchasing requirements.

For a specific MPN, package, electrical rating or quantity requirement, send the details to EGOO. We can help confirm availability, quotation and alternative sourcing options.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0728-04-1Q IC MODULE CORTEX-A9 512MB Trenz Electronic GmbH	2,135	-	RFQ	Datasheet	TE0728	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	16MB	512MB	Samtec SEM	2.360" L x 2.360" W (60.00mm x 60.00mm)	-
TE0803-04-4BE11-A IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2	1+：$634.10000	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0745-03-71I31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	4	1+：$579.00000	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0813-02-4BE81-A MODULE MPSOC 4GB DDR4 Trenz Electronic GmbH	1,629	-	RFQ	Datasheet	Zynq® UltraScale+™	Box	Active	FPGA	Xilinx Zynq UltraScale+ ZU4EG	-	-	128MB	2GB	BGA	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4DE21-L IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	0	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4GE21-L MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	0	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq™ UltraScale+™ XCZU4EG-2SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0745-03-81C31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	4,480	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Xilinx Zynq 7035 SoC XC7Z035-1FBG676C	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 70°C
TE0741-05-D2I-1-A IC MOD KINTEX-7 325T 200MHZ 32MB Trenz Electronic GmbH	2,381	-	RFQ	Datasheet	Kintex®-7	Bulk	Active	FPGA	Xilinx Kintex-7 FPGA XC7K325T-2FBG676I	-	25MHz	32MB	-	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-03-91C31-A SOM WITH AMD ZYNQ 7045-1C, 1 GBY Trenz Electronic GmbH	2,918	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-1FBG676C	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 70°C
TE0745-03-82I31-A SOM WITH AMD ZYNQ 7035-2I, 1 GBY Trenz Electronic GmbH	3,188	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7035 SoC XC7Z035-2FBG676I	-	64MB	1GB	Board-to-Board (BTB) Socket - 250	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules FAQ

How can I narrow the current Microcontrollers, Microprocessor, FPGA Modules selection?

Use the available manufacturer and technical filters to compare matching parts by specifications, stock status, pricing and datasheet information.

Can EGOO help source hard-to-find or obsolete Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send the manufacturer part number and required quantity to our sourcing team for availability, lead-time and alternative sourcing support.

Can I request a quotation for a BOM or small-batch requirement?

Yes. EGOO supports BOM sourcing, prototype quantities and small-batch purchasing. Provide your part list and quantities for a quotation review.

What information should I provide when requesting a quote?

Please provide the target part number, manufacturer, quantity and any required date code, package or delivery requirements so our team can respond more accurately.