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Power Management - Specialized

Compare the current Power Management - Specialized Power Management (PMIC) selection by manufacturer, stock status, datasheet and technical parameters. Use these details to narrow the list to parts that match your design, maintenance or purchasing requirements.

For a specific MPN, package, electrical rating or quantity requirement, send the details to EGOO. We can help confirm availability, quotation and alternative sourcing options.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC34VR5100A1EP NXP USA Inc.

MC34VR5100A1EP

IC REG 9OUT BUCK/LDO 48QFN

NXP USA Inc.

245 -
Datasheet - 48-VFQFN Exposed Pad Tray Active LS1 Communication Processors 450µA 2.8V ~ 4.5V -40°C ~ 105°C (TA) - - Surface Mount 48-HVQFN (7x7)
MC33FS6510CAE NXP USA Inc.

MC33FS6510CAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

230 -
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC13892CJVK NXP USA Inc.

MC13892CJVK

IC PWR MGMT I.MX35/51 139BGA

NXP USA Inc.

1,436 -
Datasheet - 139-TFBGA Tray Active Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply - - -40°C ~ 85°C - - Surface Mount 139-PBGA (7x7)
MC33PF8101A0ES NXP USA Inc.

MC33PF8101A0ES

IC POWER MANAGEMENT

NXP USA Inc.

467 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6502LAE NXP USA Inc.

MC33FS6502LAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

189 -
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC34PF4210A1ESR2 NXP USA Inc.

MC34PF4210A1ESR2

PF4210

NXP USA Inc.

3,999 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active Audio, Video - 2.8V ~ 4.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-QFN-EP (8x8)
MC33PF8201A0ES NXP USA Inc.

MC33PF8201A0ES

IC POWER MANAGEMENT

NXP USA Inc.

260 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8430G1ES NXP USA Inc.

MC33FS8430G1ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

133 -
Datasheet - 56-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MCZ33810EKR2 NXP USA Inc.

MCZ33810EKR2

IC DVR 8-CH ENGINE CTRL 32-SOIC

NXP USA Inc.

1,000 -
Datasheet - 32-SSOP (0.295", 7.50mm Width) Exposed Pad Tape & Reel (TR) Active - 10mA 4.5V ~ 36V -40°C ~ 125°C Automotive - Surface Mount 32-SOIC-EP
MC13892DJVK NXP USA Inc.

MC13892DJVK

IC PWR MGMT I.MX35/51 139BGA

NXP USA Inc.

2,080 -
Datasheet - 139-TFBGA Tray Active Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply - - -40°C ~ 85°C - - Surface Mount 139-PBGA (7x7)
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Power Management - Specialized FAQ

How can I narrow the current Power Management - Specialized selection?

Use the available manufacturer and technical filters to compare matching parts by specifications, stock status, pricing and datasheet information.

Can EGOO help source hard-to-find or obsolete Power Management - Specialized parts?

Yes. Send the manufacturer part number and required quantity to our sourcing team for availability, lead-time and alternative sourcing support.

Can I request a quotation for a BOM or small-batch requirement?

Yes. EGOO supports BOM sourcing, prototype quantities and small-batch purchasing. Provide your part list and quantities for a quotation review.

What information should I provide when requesting a quote?

Please provide the target part number, manufacturer, quantity and any required date code, package or delivery requirements so our team can respond more accurately.

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