PRODUCT DIRECTORY

RFI and EMI - Contacts, Fingerstock and Gaskets

Browse available RFI and EMI - Contacts, Fingerstock and Gaskets components by manufacturer and part number. Review stock status, datasheets and key technical parameters to compare suitable options for design, maintenance, replacement or purchasing.

If you already have a target MPN or BOM, send it to EGOO with the required quantity. Our sourcing team can check availability, lead time and quotation options, including hard-to-find and obsolete parts.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0098054002 Laird Technologies EMI

0098054002

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

2,649 -
Datasheet Ultrasoft All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - Adhesive 121°C
0097054017 Laird Technologies EMI

0097054017

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

1,176 -
Datasheet All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive 121°C
4520AC51K09600 Laird Technologies EMI

4520AC51K09600

RFI FOF GASKET PU

Laird Technologies EMI

4,935 -
Datasheet 51K Bulk Active Fabric Over Foam Square 2.000" (50.80mm) 96.000" (2.44m) 2.000" (50.80mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
25-78FS-BD-85.875-NTP Leader Tech Inc.

25-78FS-BD-85.875-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

4,146 -
Datasheet - Bulk Active Fingerstock - 0.780" (19.81mm) 85.920" (2.18m) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0078007217 Laird Technologies EMI

0078007217

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

4,924 -
Datasheet Ultrasoft Hook-on Bulk Active Fingerstock - 0.600" (15.24mm) 16.200" (411.48mm) 0.152" (3.86mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
4688PA51H09600 Laird Technologies EMI

4688PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,185 -
Datasheet 51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 96.000" (2.44m) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
37-131-1007-09600 Parker Chomerics

37-131-1007-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

4,152 -
Datasheet SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 1.614" (41.00mm) 8.00' (2.44m) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
0097054219 Laird Technologies EMI

0097054219

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

2,207 -
Datasheet Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
0097060719 Laird Technologies EMI

0097060719

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

1,579 -
Datasheet - Bulk Active Fingerstock - - 16.000" (406.40mm) 0.170" (4.32mm) Beryllium Copper Nickel 299.21µin (7.60µm) Clip 121°C
0098053817 Laird Technologies EMI

0098053817

AP,STR,SNB,USF,PSA/.250X.780X.37

Laird Technologies EMI

4,273 -
Datasheet * Bulk Active - - - - - - - - - -
0C97044017 Laird Technologies EMI

0C97044017

RFI FINGERSTOCK BECU TIN HARDWR

Laird Technologies EMI

3,631 -
Datasheet Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder 121°C
8516-0359-56 Laird Technologies EMI

8516-0359-56

MILCONNECTOR,MIM613 35.12X30.15X

Laird Technologies EMI

4,337 -
Datasheet MIL Connector Bulk Active - - - - - - - - - -
8864-0110-93 Laird Technologies EMI

8864-0110-93

RFI GASKET

Laird Technologies EMI

1,792 -
Datasheet Electroseal™ Bulk Active Gasket Round 0.250" (6.35mm) - 0.250" (6.35mm) - - - - -
4358PA51G09600 Laird Technologies EMI

4358PA51G09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

2,948 -
Datasheet 51G Bulk Active Fabric Over Foam D-Shape 0.098" (2.49mm) 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
0098051502 Laird Technologies EMI

0098051502

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

4,364 -
Datasheet Ultrasoft Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper - 299.21µin (7.60µm) Adhesive 121°C
4912PA51H08400 Laird Technologies EMI

4912PA51H08400

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,978 -
Datasheet ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 7.00' (2.13m) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
13-30RH-SN-0.356 Leader Tech Inc.

13-30RH-SN-0.356

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

1,798 -
Datasheet - Bulk Active Fingerstock - 0.300" (7.62mm) 0.356" (9.04mm) 0.130" (3.30mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
3-S-23T-BD-24-NTP Leader Tech Inc.

3-S-23T-BD-24-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

4,057 -
Datasheet - Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
7-19PCI-SS-14.6 Leader Tech Inc.

7-19PCI-SS-14.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

1,891 -
Datasheet - Bulk Active Fingerstock - 0.180" (4.57mm) 14.600" (370.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
7-19PCI-SS-4.6 Leader Tech Inc.

7-19PCI-SS-4.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

4,286 -
Datasheet - Bulk Active Fingerstock - 0.180" (4.57mm) 4.600" (116.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
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COMPONENT SOURCING SUPPORT

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RFI and EMI - Contacts, Fingerstock and Gaskets FAQ

What RFI and EMI - Contacts, Fingerstock and Gaskets components can I source from EGOO?

You can browse available RFI and EMI - Contacts, Fingerstock and Gaskets product families, manufacturers and part numbers on this page, then review stock, datasheets and technical information for suitable options.

Can EGOO help with hard-to-source or obsolete RFI and EMI - Contacts, Fingerstock and Gaskets parts?

Yes. EGOO provides sourcing support for shortage, obsolete and hard-to-find electronic components. Send us the target manufacturer part number and quantity for checking.

Does EGOO support BOM and small-batch sourcing?

Yes. We support BOM sourcing, prototype requirements and small-batch supply, together with stock, lead-time and quotation assistance.

How do I request pricing and availability?

Submit the manufacturer part number, required quantity and any package, date-code or delivery requirements through the RFQ form, and our team will review available sourcing options.

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