REFINED COMPONENT RESULTS

RFI and EMI - Contacts, Fingerstock and Gaskets

Compare the current RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless selection by manufacturer, stock status, datasheet and technical parameters. Use these details to narrow the list to parts that match your design, maintenance or purchasing requirements.

For a specific MPN, package, electrical rating or quantity requirement, send the details to EGOO. We can help confirm availability, quotation and alternative sourcing options.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0C97044017 Laird Technologies EMI

0C97044017

RFI FINGERSTOCK BECU TIN HARDWR

Laird Technologies EMI

3,631 -
Datasheet Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder 121°C
8516-0359-56 Laird Technologies EMI

8516-0359-56

MILCONNECTOR,MIM613 35.12X30.15X

Laird Technologies EMI

4,337 -
Datasheet MIL Connector Bulk Active - - - - - - - - - -
8864-0110-93 Laird Technologies EMI

8864-0110-93

RFI GASKET

Laird Technologies EMI

1,792 -
Datasheet Electroseal™ Bulk Active Gasket Round 0.250" (6.35mm) - 0.250" (6.35mm) - - - - -
4358PA51G09600 Laird Technologies EMI

4358PA51G09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

2,948 -
Datasheet 51G Bulk Active Fabric Over Foam D-Shape 0.098" (2.49mm) 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
0098051502 Laird Technologies EMI

0098051502

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

4,364 -
Datasheet Ultrasoft Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper - 299.21µin (7.60µm) Adhesive 121°C
4912PA51H08400 Laird Technologies EMI

4912PA51H08400

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,978 -
Datasheet ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 7.00' (2.13m) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
0098054217 Laird Technologies EMI

0098054217

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

2,268 -
Datasheet Ultrasoft Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 16.000" (406.40mm) 0.080" (2.03mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097056717T01524 Laird Technologies EMI

0097056717T01524

TWT,STR,SNB,PSA,CTL 6"

Laird Technologies EMI

3,238 -
Datasheet - Bulk Obsolete - - - - - - - - - -
0098043602 Laird Technologies EMI

0098043602

RFI FINGERSTOCK BECU UNPLAT SLOT

Laird Technologies EMI

3,991 -
Datasheet - Bulk Active Fingerstock - 0.940" (23.88mm) - 0.250" (6.35mm) Beryllium Copper Unplated - Slot 121°C
8516-9212-56 Laird Technologies EMI

8516-9212-56

RFI GASKET ADH

Laird Technologies EMI

1,454 -
Datasheet D Connector Bulk Active Gasket Rectangle 0.800" (20.32mm) 2.840" (72.14mm) 0.030" (0.76mm) - - - Adhesive -
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RFI and EMI - Contacts, Fingerstock and Gaskets FAQ

How can I narrow the current RFI and EMI - Contacts, Fingerstock and Gaskets selection?

Use the available manufacturer and technical filters to compare matching parts by specifications, stock status, pricing and datasheet information.

Can EGOO help source hard-to-find or obsolete RFI and EMI - Contacts, Fingerstock and Gaskets parts?

Yes. Send the manufacturer part number and required quantity to our sourcing team for availability, lead-time and alternative sourcing support.

Can I request a quotation for a BOM or small-batch requirement?

Yes. EGOO supports BOM sourcing, prototype quantities and small-batch purchasing. Provide your part list and quantities for a quotation review.

What information should I provide when requesting a quote?

Please provide the target part number, manufacturer, quantity and any required date code, package or delivery requirements so our team can respond more accurately.

PART SELECTION SUPPORT

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